Senior/Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics

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About TIE

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our Mission

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Our Impact

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Our Technology

Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

The Principal EDA Engineer will drive the hands-on implementation of electronic design automation (EDA) solutions for TIE's multi-component and chiplet integration platforms. The Principal Engineer will focus on developing and optimizing design kits, simulation methodologies, and reference flows from concept to deployment, acting as a key technical contributor and innovator.

• Support the EDA implementation roadmap for TIE; multi-component and chiplet integration platforms, working hands-on with design kits, simulation tools, and reference flows.
• Develop and maintain comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption.
• Work directly with EDA tools (Synopsys, Cadence, Ansys, Siemens) and packaging design teams to integrate electrical, thermal, and mechanical simulation workflows. Serve as a technical resource in design reviews and customer engagements.
• Work on Jira, Version Control tools to enable the Internal and External Development teams.
• Apply AI based deployment of the EDA flows, PDK development.
• Collaborate with engineering, packaging design, product marketing, and EDA vendors to ensure design enablement flows are validated, documented, and continuously refined.
• Create detailed technical documentation, user guides, reference flows, and onboarding materials to support customer design teams.
• Assist in program planning activities covering scope, schedules, risk mitigation, and resource allocation to support predictable execution.
• Monitor EDA market trends and competitive developments, providing technical insights to guide tool integration decisions and platform improvements.
• Support program transparency and accountability, ensuring technical deliverables are on track and stakeholders are informed of progress and risks.
  

• Drive the strategic vision and implementation roadmap for EDA across TIE; multi-component and chiplet integration platforms-spanning design kits, simulation tools, and reference flows from concept to production deployment.
• Lead technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including multi-physics modeling, qualification strategies, and customer enablement collateral. Own roadmap decisions and quality standards.
• Set technical direction for EDA packaging workflows, establishing best practices and qualification criteria that span electrical, RF, thermal, and mechanical simulation domains. Represent TIE as a technical authority in industry working groups, customer design reviews, and ecosystem partnerships.
• Manage relationships with TIE subcontractors, vendors, and EDA partners (Synopsys, Cadence, Ansys, Siemens). Define clear Statements of Work (SoW) with quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed to ensure accountability.
• Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors to align design enablement flows, establish validation protocols, and continuously improve platform capabilities.
• Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication. Deliver predictable outcomes in fast-paced, multi-stakeholder engagements.
• Own the creation of comprehensive technical documentation, reference architectures, onboarding frameworks, and strategic collateral that position TIE as an EDA innovator and strengthen customer confidence.
• Monitor EDA market trends, competitive developments, and emerging technologies. Provide actionable strategic insights to guide tool integration roadmap, design enablement priorities, and platform differentiation.
• Champion a culture of accountability and transparency across all program workstreams. Ensure stakeholders are informed, expectations are clearly defined and communicated, and commitments are met. Mentor junior technical staff and build high-performing teams.

• BS in Electrical Engineering, Computer Engineering, or related discipline.
• 8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.
• Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.
• Hands-on experience building and deploying packaging-related PDKs/ADKs. Strong understanding of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains.
• Exceptional communication skills. You can simplify the complex, create clear technical deliverables, and build trust with technical and business audiences.
• Startup DNA. You are energized by ambiguity, act with urgency, and take personal ownership of technical outcomes.
• Execution mindset. You have demonstrated experience working in a hands-on role driving technical progress across multiple initiatives.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30-50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.
  

• MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
• 12+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, advanced packaging workflows, or related technical leadership.
• Demonstrated expertise with Synopsys, Cadence, Ansys, or Siemens design flows. Proven ability to guide tool strategy, qualification methodology, and integration roadmaps.
• Proven track record of designing, deploying, and managing PDK/ADK programs at scale. Deep expertise in multi-physics modeling, simulation qualification, and cross-domain validation strategies.
• Strong program management experience. Demonstrated success defining program scope, managing multi-stakeholder dependencies, holding teams accountable to milestones, and delivering results in complex environments.
• Proven vendor and partner management skills. You can clearly define expectations, structure Statements of Work with quantifiable deliverables, and hold teams accountable to milestones and quality standards.
• Exceptional communication and executive presence. You simplify the complex, inspire confidence in both technical and business audiences, and are a sought-after technical leader.
• Entrepreneurial mindset and demonstrated ability to build technical programs and teams from the ground up. You thrive in ambiguous environments and drive results with urgency.
• Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30-50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

• MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
• Prior experience supporting program planning, milestone tracking, and cross-functional coordination in complex technical projects.
• Exposure to vendor and partner collaboration on design enablement initiatives.

• Prior experience as a technical leader or principal engineer in semiconductor, EDA, or advanced packaging contexts.
• Demonstrated mentoring and team-building capabilities; you have developed junior technical talent and fostered high-performing engineering organizations.
• Visibility in industry forums, standards bodies, or EDA vendor partnerships. Strong reputation as a technical innovator and thought leader in chiplet and heterogeneous integration.

TIE Pays Industry Competitive Salaries

• Uniforms and/or personal protection equipment (furnished)
• May work in all weather conditions
• May work in extreme temperatures
• May work around chemical fumes
• May work around standard office conditions
• May work around biohazards
• May work around chemicals
• May work around electrical and mechanical hazards
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (ex: using a mouse)
• Climbing of stairs
• Climbing of ladders
• Lifting and moving 25 pounds

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor

Importantfor applicants who are NOT current university employees or contingent workers:You will be prompted to submit your resume the first time you apply, then you will be provided an option to upload a new Resume for subsequent applications. Any additional Required Materials (letter of interest, references, etc.) will be uploaded in the Application Questions section; you will be able to multi-select additional files. Before submitting your online job application, ensure thatALLRequired Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers:As a current university employee or contingent worker, you MUST apply within Workday by searching for Find UT Jobs. If you are a current University employee, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile before you apply. This information will be pulled in to your application. The application is one page and you will be prompted to upload your resume. In addition, you must respond to the application questionspresented to upload any additional Required Materials (letter of interest, references, etc.) that were noted above.

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Employment Eligibility:

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Retirement Plan Eligibility:

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Background Checks:

A criminal history background check will be required for finalist(s) under consideration for this position.

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Equal Opportunity Employer:

The University of Texas at Austin, as an equal opportunity/affirmative action employer,complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

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Pay Transparency:

The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.

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Employment Eligibility Verification:

If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

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E-Verify:

The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university's company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following:

• E-Verify Poster (English and Spanish) [PDF]
• Right to Work Poster (English) [PDF]
• Right to Work Poster (Spanish) [PDF]

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Compliance:

Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act). If this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in HOP-3031.

The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may access the most recent report here or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.