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HW Engineer, Thermal

NOKIA
$89,000 - $130,000 USD * Plus, potential incentive/variable compensation for eligible roles.
United States, Texas, Dallas
3201 Olympus Boulevard (Show on map)
Mar 09, 2026

We are looking for an experienced HW Engineer who has subject matter expertise in thermal management and thermal design of electronic enclosures. This engineer would be a key contributor in thermal related design work of telecom equipment.

As part of the team, you will:

  • Responsible for thermal design, simulation analysis, and test validation for radio products.
  • Carry out thermal analysis at system level, board level, and component level with minimal to no support.
  • Evaluate the Computation Fluid Dynamics (CFD) results using the heat transfer and thermodynamic principles, in conjunction with thorough comparison against analytical results.
  • Review thermal setup and validate the CFD results with results from the tests carried out on manufactured products in experimental testing.
  • Prepare technical reports and presentations with simulation plots, suggestions, and recommendations.
  • Contribute towards ongoing internal research activities.
  • Travel: up to 10%, domestic and international

You have:

  • At least 5 years' experience as a design, simulation, and/or test engineer, focused on thermal solutions
  • Understanding heat transfer theories
  • Proven skill set to use Computation Fluid Dynamics to evaluate passive and forced air-cooled solutions
  • Proven ability to grasp new concepts and transform them into practical solutions
  • Familiarity with thermal measurement technology and test tools such as temperature data logger, IR camera, air chamber, air speed meter etc.

It would be nice if you also had:

  • Good mechanical aptitude with experience using power and hand tools found in a machine shop
  • Bachelor's degree mechanical engineering or related engineering degree. Master's degree is plus
  • Experience of Flotherm & Flotherm XT or other CFD analysis tool
  • Prior experience in managing thermal aspects of electronic packaging
  • Experience in the telecommunication, automotive, and/or aerospace industry is a plus
  • Excellent verbal and written communication skills in English. Chinese is a plus

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world.

Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

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