Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0

ESSENTIAL FUNCTIONS

* Support semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and production handoff.
* Translate customer requirements into executable fabrication process plans and assist with feasibility assessments.
* Serve as a technical liaison to partner university nanofabrication facilities and industry fabs; participate in recurring technical progress reviews.
* Assist with process development, recipe documentation, troubleshooting, and yield improvement efforts in nanofabrication environments.
* Coordinate wafer-to-package transitions and collaborate with packaging partners on assembly and test requirements.
* Support process transfer and readiness assessments across partner facilities.
* Collaborate with internal research teams on data-driven process optimization and AI/ML-enabled manufacturing analytics.
* Maintain documentation of process flows, metrology results, and partner capabilities.

MINIMUM QUALIFICATIONS* Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field and 5+ years of industrial semiconductor fabrication experience;
* Working knowledge of semiconductor device physics and fabrication fundamentals.
* Experience supporting process development, troubleshooting, or yield improvement in a fabrication facility.
* Strong written and verbal communication skills and ability to collaborate across technical teams.
* Candidate must be a U.S. Person (U.S. citizen or lawful permanent resident).

PREFERRED QUALIFICATIONS

* Master's degree in a related field and 2+ years of industrial semiconductor fabrication experience; OR
* PhD in a related field with 0-5 years of post-degree experience.

* Hands-on experience in micro- or nanofabrication (lithography, deposition, etch, metrology)